| CVE |
Vendors |
Products |
Updated |
CVSS v3.1 |
| Memory corruption when HLOS allocates the response payload buffer to copy the data received from ADSP in response to AVCS_LOAD_MODULE command. |
| Transient DOS when WLAN firmware receives "reassoc response" frame including RIC_DATA element. |
| Transient DOS while parsing WPA IES, when it is passed with length more than expected size. |
| Memory corruption when BTFM client sends new messages over Slimbus to ADSP. |
| Memory corruption when there is failed unmap operation in GPU. |
| Memory Corruption in WLAN HOST while processing WLAN FW request to allocate memory. |
| Memory corruption in Core while processing control functions. |
| Information disclosure while deriving keys for a session for any Widevine use case. |
| Memory corruption in HLOS while invoking IOCTL calls from user-space. |
| Transient DOS while processing IKEv2 Informational request messages, when a malformed fragment packet is received. |
| Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE. |
| Information Disclosure in Data Modem while performing a VoLTE call with an undefined RTCP FB line value. |
| Memory corruption in TZ Secure OS while requesting a memory allocation from TA region. |
| Memory corruption in HLOS while running playready use-case. |
| Transient DOS in Data Modem during DTLS handshake. |
| Possible use after free when process shell memory is freed using IOCTL call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking |
| Memory corruption in Audio during playback with speaker protection. |
| Denial of service in WLAN due to out-of-bound read happens while processing VHT action frame in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking |
| Memory corruption in WLAN due to out of bound array access during connect/roaming in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables |
| Information disclosure in WLAN due to improper length check while processing authentication handshake in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking |