| CVE |
Vendors |
Products |
Updated |
CVSS v3.1 |
| Memory corruption while processing data packets in diag received from Unix clients. |
| Memory corruption in Audio when memory map command is executed consecutively in ADSP. |
| Transient DOS can occur when the driver parses the per STA profile IE and tries to access the EXTN element ID without checking the IE length. |
| Transient DOS may occur when processing vendor-specific information elements while parsing a WLAN frame for BTM requests. |
| Information disclosure while invoking callback function of sound model driver from ADSP for every valid opcode received from sound model driver. |
| Memory corruption in video while parsing the Videoinfo, when the size of atom is greater than the videoinfo size. |
| Memory corruption while invoking IOCTLs calls from user space for internal mem MAP and internal mem UNMAP. |
| Memory corruption while copying a keyblob`s material when the key material`s size is not accurately checked. |
| Memory corruption while copying the result to the transmission queue which is shared between the virtual machine and the host. |
| Transient DOS while processing 11AZ RTT management action frame received through OTA. |
| Memory corruption in Core when updating rollback version for TA and OTA feature is enabled. |
| Cryptographic issue in Automotive while unwrapping the key secs2d and verifying with RPMB data. |
| Memory corruption in TZ Secure OS while requesting a memory allocation from TA region. |
| Information disclosure in Core services while processing a Diag command. |
| Memory corruption in HLOS while running playready use-case. |
| Transient DOS in Data Modem during DTLS handshake. |
| Possible use after free when process shell memory is freed using IOCTL call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking |
| Memory corruption due to use after free issue in kernel while processing ION handles in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables |
| Memory corruption in Audio during playback with speaker protection. |
| Memory corruption in Automotive Multimedia due to improper access control in HAB. |
