| CVE |
Vendors |
Products |
Updated |
CVSS v3.1 |
| Memory corruption when resource manager sends the host kernel a reply message with multiple fragments. |
| Memory corruption while operating the mailbox in Automotive. |
| Memory corruption while processing Listen Sound Model client payload buffer when there is a request for Listen Sound session get parameter from ST HAL. |
| Transient DOS while parsing IPv6 extension header when WLAN firmware receives an IPv6 packet that contains `IPPROTO_NONE` as the next header. |
| Transient DOS while processing DL NAS Transport message, as specified in 3GPP 24.501 v16. |
| Memory Corruption in WLAN HOST while parsing QMI WLAN Firmware response message. |
| Transient DOS during hypervisor virtual I/O operation in a virtual machine. |
| Memory corruption when there is failed unmap operation in GPU. |
| Memory Corruption in Data Modem while making a MO call or MT VOLTE call. |
| Transient DOS while parsing MBSSID during new IE generation in beacon/probe frame when IE length check is either missing or improper. |
| Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame. |
| Transient DOS while processing multiple IKEV2 Informational Request to device from IPSEC server with different identifiers. |
| Memory corruption in TZ Secure OS while loading an app ELF. |
| Memory corruption in Core when updating rollback version for TA and OTA feature is enabled. |
| Memory corruption in TZ Secure OS while requesting a memory allocation from TA region. |
| Memory corruption in HLOS while running playready use-case. |
| Transient DOS in Data Modem during DTLS handshake. |
| Possible use after free when process shell memory is freed using IOCTL call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking |
| Memory corruption due to use after free issue in kernel while processing ION handles in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables |
| Memory corruption in Audio during playback with speaker protection. |